Subcooled flow boiling in diamond/Cu microchannel heat sinks for near-junction chip cooling
Materials for thermal management that possess low coefficient of linear thermal expansion and high thermal conductivity can achieve “near-junction cooling” for chips. However, limited research exists on the application of the latest generation of diamond/Cu (DC) composites in microchannel phase-chan...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-05-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25002412 |
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