High-strength Au–Au bonding for temperature and pressure integrated sensor
With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor prepar...
Saved in:
| Main Authors: | , , , , , , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425001188 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832594115429138432 |
|---|---|
| author | Mimi Huang Yong Xia Xiangguang Han Yi Gao Shuai Chen Zeyu Cui Cheng Zhang Yushan Gao Zhixia Qiao Yang Lv Xiaowei Hou Chenying Wang Ping Yang Libo Zhao |
| author_facet | Mimi Huang Yong Xia Xiangguang Han Yi Gao Shuai Chen Zeyu Cui Cheng Zhang Yushan Gao Zhixia Qiao Yang Lv Xiaowei Hou Chenying Wang Ping Yang Libo Zhao |
| author_sort | Mimi Huang |
| collection | DOAJ |
| description | With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O2 plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors. |
| format | Article |
| id | doaj-art-0389ab98f8fa446f9d24a845a946ad89 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-0389ab98f8fa446f9d24a845a946ad892025-01-20T04:17:31ZengElsevierJournal of Materials Research and Technology2238-78542025-03-013512391249High-strength Au–Au bonding for temperature and pressure integrated sensorMimi Huang0Yong Xia1Xiangguang Han2Yi Gao3Shuai Chen4Zeyu Cui5Cheng Zhang6Yushan Gao7Zhixia Qiao8Yang Lv9Xiaowei Hou10Chenying Wang11Ping Yang12Libo Zhao13State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Instrument Science and Technology, Xi'an Jiaotong University, Xi'an, 710049, China; Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai, 265503, China; State Industry-Education Integration Center for Medical Innovations at Xi'an Jiaotong University, Xi'an, 710049, China; Corresponding author. State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China.State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Instrument Science and Technology, Xi'an Jiaotong University, Xi'an, 710049, China; Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai, 265503, China; State Industry-Education Integration Center for Medical Innovations at Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaXi'an Aerospace Propulsion Institute, Xi'an, 710049, ChinaSchool of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, China; Xi'an Aerospace Propulsion Institute, Xi'an, 710049, ChinaNingbo CRRC Times Transducer Technology Co., LTD, Ningbo, 315000, ChinaNingbo CRRC Times Transducer Technology Co., LTD, Ningbo, 315000, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Instrument Science and Technology, Xi'an Jiaotong University, Xi'an, 710049, China; State Industry-Education Integration Center for Medical Innovations at Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, ChinaState Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China; School of Instrument Science and Technology, Xi'an Jiaotong University, Xi'an, 710049, China; Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai, 265503, China; State Industry-Education Integration Center for Medical Innovations at Xi'an Jiaotong University, Xi'an, 710049, China; Corresponding author. State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi'an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi'an Jiaotong University, Xi'an, 710049, China.With the development of intelligent and integrated electronic devices, leadless integrated sensors have a broad development. One of the most critical processes in TSV (Through Silicon Via) leadless packaging is Au–Au bonding, which the bond strength determines the success or failure of sensor preparation. In this research, the effect of the bonding temperature on the bonding strength was studied for the designed the temperature and pressure integrated sensor. To further increase the bonding strength, plasma treatment of the metal surface was applied. The influence of various plasma atmospheres and treatment times on the surface morphology, surface hydrophilicity, chemical state and the bonding rate were studied. And bonding interfaces under different bonding conditions were characterized. Finally, after 120 s of O2 plasma treatment and bonding for 1 h at 450 °C and 4000 mbar, the bond strength was increased by 68%, reaching 27 MPa, which enhances the feasibility of the preparation of temperature and pressure integrated sensors.http://www.sciencedirect.com/science/article/pii/S2238785425001188Integrated sensor leadlessAu–Au bondingPlasma |
| spellingShingle | Mimi Huang Yong Xia Xiangguang Han Yi Gao Shuai Chen Zeyu Cui Cheng Zhang Yushan Gao Zhixia Qiao Yang Lv Xiaowei Hou Chenying Wang Ping Yang Libo Zhao High-strength Au–Au bonding for temperature and pressure integrated sensor Journal of Materials Research and Technology Integrated sensor leadless Au–Au bonding Plasma |
| title | High-strength Au–Au bonding for temperature and pressure integrated sensor |
| title_full | High-strength Au–Au bonding for temperature and pressure integrated sensor |
| title_fullStr | High-strength Au–Au bonding for temperature and pressure integrated sensor |
| title_full_unstemmed | High-strength Au–Au bonding for temperature and pressure integrated sensor |
| title_short | High-strength Au–Au bonding for temperature and pressure integrated sensor |
| title_sort | high strength au au bonding for temperature and pressure integrated sensor |
| topic | Integrated sensor leadless Au–Au bonding Plasma |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425001188 |
| work_keys_str_mv | AT mimihuang highstrengthauaubondingfortemperatureandpressureintegratedsensor AT yongxia highstrengthauaubondingfortemperatureandpressureintegratedsensor AT xiangguanghan highstrengthauaubondingfortemperatureandpressureintegratedsensor AT yigao highstrengthauaubondingfortemperatureandpressureintegratedsensor AT shuaichen highstrengthauaubondingfortemperatureandpressureintegratedsensor AT zeyucui highstrengthauaubondingfortemperatureandpressureintegratedsensor AT chengzhang highstrengthauaubondingfortemperatureandpressureintegratedsensor AT yushangao highstrengthauaubondingfortemperatureandpressureintegratedsensor AT zhixiaqiao highstrengthauaubondingfortemperatureandpressureintegratedsensor AT yanglv highstrengthauaubondingfortemperatureandpressureintegratedsensor AT xiaoweihou highstrengthauaubondingfortemperatureandpressureintegratedsensor AT chenyingwang highstrengthauaubondingfortemperatureandpressureintegratedsensor AT pingyang highstrengthauaubondingfortemperatureandpressureintegratedsensor AT libozhao highstrengthauaubondingfortemperatureandpressureintegratedsensor |