Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing

Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing

Asymmetric cryorolling demonstrates significant potential for producing materials with high strength and excellent electrical conductivity. This study presents an innovative Dynamic Offsets and Shear Force Adjustments Cryorolling (DSCR) technique coupled with short-time annealing (DSCRA), systematic...

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Bibliographic Details
Main Authors: Longfei Xu, Renhao Wu, Shi Woo Lee, Xin Xue, Yan Peng, Yuhui Wang, Hyoung Seop Kim
Format: Article
Language:English
Published: Elsevier 2025-07-01
Series:Materials & Design
Subjects:
Dynamic offsets
Cryorolling
Pure copper
Mechanical properties
Electrical conductivity
Thermal stability
Online Access:http://www.sciencedirect.com/science/article/pii/S0264127525006057
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