Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing
Asymmetric cryorolling demonstrates significant potential for producing materials with high strength and excellent electrical conductivity. This study presents an innovative Dynamic Offsets and Shear Force Adjustments Cryorolling (DSCR) technique coupled with short-time annealing (DSCRA), systematic...
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
|
| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525006057 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1850209073544298496 |
|---|---|
| author | Longfei Xu Renhao Wu Shi Woo Lee Xin Xue Yan Peng Yuhui Wang Hyoung Seop Kim |
| author_facet | Longfei Xu Renhao Wu Shi Woo Lee Xin Xue Yan Peng Yuhui Wang Hyoung Seop Kim |
| author_sort | Longfei Xu |
| collection | DOAJ |
| description | Asymmetric cryorolling demonstrates significant potential for producing materials with high strength and excellent electrical conductivity. This study presents an innovative Dynamic Offsets and Shear Force Adjustments Cryorolling (DSCR) technique coupled with short-time annealing (DSCRA), systematically investigating its synergy in tailoring mechanical properties, microstructural, recrystallization behavior, and thermal stability of pure copper. Compared to conventional symmetric rolling (SR) followed by annealing (SRA), the DSCRA specimens exhibit 27.9% higher microhardness and 18.3% enhanced ultimate tensile strength under annealing at 180 °C for 15 min, primarily driven by optimized dislocation strengthening and grain boundary strengthening. Both SRA and DSCRA specimens achieve >95% IACS electrical conductivity at elevated annealing temperatures. Microstructural analysis reveals that DSCRA specimens generate weaker and more homogeneous texture prior to recrystallization, resulting in 31.3% higher grain growth activation energy and superior thermal stability. These findings establish DSCRA as an industrially scalable strategy for manufacturing high-performance copper plates, providing critical insights for designing deformation-annealing protocols for conductive structural materials. |
| format | Article |
| id | doaj-art-019f6007ea3b448aab8ab17f2c06f315 |
| institution | OA Journals |
| issn | 0264-1275 |
| language | English |
| publishDate | 2025-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Materials & Design |
| spelling | doaj-art-019f6007ea3b448aab8ab17f2c06f3152025-08-20T02:10:06ZengElsevierMaterials & Design0264-12752025-07-0125511418510.1016/j.matdes.2025.114185Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealingLongfei Xu0Renhao Wu1Shi Woo Lee2Xin Xue3Yan Peng4Yuhui Wang5Hyoung Seop Kim6National Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao 066004, China; Graduate Institute of Ferrous & Energy Materials Technology, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of KoreaGraduate Institute of Ferrous & Energy Materials Technology, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of KoreaDepartment of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of KoreaNational Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao 066004, ChinaNational Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao 066004, ChinaNational Engineering Research Center for Equipment and Technology of Cold Strip Rolling, Yanshan University, Qinhuangdao 066004, China; Corresponding author.Graduate Institute of Ferrous & Energy Materials Technology, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea; Institute for Convergence Research and Education in Advanced Technology, Yonsei University, Seoul 03722, Republic of Korea; Advanced Institute for Materials Research (WPI-AIMR), Tohoku University, Sendai 980-8577, Japan; Corresponding author at: Graduate Institute of Ferrous & Energy Materials Technology, Pohang University of Science and Technology (POSTECH), Pohang, 37673, Republic of Korea.Asymmetric cryorolling demonstrates significant potential for producing materials with high strength and excellent electrical conductivity. This study presents an innovative Dynamic Offsets and Shear Force Adjustments Cryorolling (DSCR) technique coupled with short-time annealing (DSCRA), systematically investigating its synergy in tailoring mechanical properties, microstructural, recrystallization behavior, and thermal stability of pure copper. Compared to conventional symmetric rolling (SR) followed by annealing (SRA), the DSCRA specimens exhibit 27.9% higher microhardness and 18.3% enhanced ultimate tensile strength under annealing at 180 °C for 15 min, primarily driven by optimized dislocation strengthening and grain boundary strengthening. Both SRA and DSCRA specimens achieve >95% IACS electrical conductivity at elevated annealing temperatures. Microstructural analysis reveals that DSCRA specimens generate weaker and more homogeneous texture prior to recrystallization, resulting in 31.3% higher grain growth activation energy and superior thermal stability. These findings establish DSCRA as an industrially scalable strategy for manufacturing high-performance copper plates, providing critical insights for designing deformation-annealing protocols for conductive structural materials.http://www.sciencedirect.com/science/article/pii/S0264127525006057Dynamic offsetsCryorollingPure copperMechanical propertiesElectrical conductivityThermal stability |
| spellingShingle | Longfei Xu Renhao Wu Shi Woo Lee Xin Xue Yan Peng Yuhui Wang Hyoung Seop Kim Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing Materials & Design Dynamic offsets Cryorolling Pure copper Mechanical properties Electrical conductivity Thermal stability |
| title | Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing |
| title_full | Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing |
| title_fullStr | Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing |
| title_full_unstemmed | Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing |
| title_short | Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing |
| title_sort | enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing |
| topic | Dynamic offsets Cryorolling Pure copper Mechanical properties Electrical conductivity Thermal stability |
| url | http://www.sciencedirect.com/science/article/pii/S0264127525006057 |
| work_keys_str_mv | AT longfeixu enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing AT renhaowu enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing AT shiwoolee enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing AT xinxue enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing AT yanpeng enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing AT yuhuiwang enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing AT hyoungseopkim enhancedstrengthandelectricalconductivityinpurecopperviadynamicoffsetsandshearforceadjustmentscryorollingcombiningannealing |