APA (7th ed.) Citation

Xu, L., Wu, R., Lee, S. W., Xue, X., Peng, Y., Wang, Y., & Kim, H. S. Enhanced strength and electrical conductivity in pure copper via dynamic offsets and shear force adjustments cryorolling combining annealing. Elsevier.

Chicago Style (17th ed.) Citation

Xu, Longfei, Renhao Wu, Shi Woo Lee, Xin Xue, Yan Peng, Yuhui Wang, and Hyoung Seop Kim. Enhanced Strength and Electrical Conductivity in Pure Copper via Dynamic Offsets and Shear Force Adjustments Cryorolling Combining Annealing. Elsevier.

MLA (9th ed.) Citation

Xu, Longfei, et al. Enhanced Strength and Electrical Conductivity in Pure Copper via Dynamic Offsets and Shear Force Adjustments Cryorolling Combining Annealing. Elsevier.