Improvement of thermoelectric, hardness, and strength properties with Cu exchange in Zn-based ternary alloy
The electrical properties, hardness, and strength of the Zn-based ternary alloys were determined based on their microstructural properties. Formation and microstructural analyses were performed on Cu5Zn8, Al4Cu9, and Cu3Al intermetallic phases. When the electrical properties of the alloy were examin...
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-01-01
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| Series: | Kuwait Journal of Science |
| Subjects: | |
| Online Access: | https://www.sciencedirect.com/science/article/pii/S230741082300127X |
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| Summary: | The electrical properties, hardness, and strength of the Zn-based ternary alloys were determined based on their microstructural properties. Formation and microstructural analyses were performed on Cu5Zn8, Al4Cu9, and Cu3Al intermetallic phases. When the electrical properties of the alloy were examined, it was seen that the electrical resistivity increased according to the amount of Cu. Electrical resistivity values were obtained in the range of 9.7216 × 10−8 −6.5881 × 10−7 Ωm by DC four-point probe method (FPPM). The results obtained with the FPPM showed good electrical resistance, which can be applied to electronics as a lead-free soldering material. For each composition of Zn–Al–Cu alloys, the hardness value was measured within the range of 82.70–94.03 Hv0.1, the ultimate tensile strength (UTS) was measured within the range of 133.48–202.56 MPa. In addition, yield strength (YS0.2) was measured within the range of 128.22–174.67 MPa. The results of our study are compatible with the expectation that the highest strength, yield strength, hardness etc. properties will be obtained in eutectic alloy systems. |
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| ISSN: | 2307-4116 |