Micro‐/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large‐Area Silicon Multichips

Micro‐/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large‐Area Silicon Multichips

With the rising demand for data centers, the need for an efficient thermal management approach becomes increasingly critical. This study examines the enhancement in pool boiling heat transfer on a customized multichip module, designed to mimic artificial intelligence chip layouts for high‐performanc...

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Bibliographic Details
Main Authors: Youngseob Lee, Kiwan Kim, Yunseo Kim, Daeyoung Kong, Jeonghwan Park, Daehyuk Son, Sungchan Kang, Seogwoo Hong, Hyoungsoon Lee
Format: Article
Language:English
Published: Wiley-VCH 2025-05-01
Series:Small Structures
Subjects:
critical heat flux
heat transfer coefficient
hierarchical structures
multichip modules
pool boiling
Online Access:https://doi.org/10.1002/sstr.202400512
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