The Latest Packing Technology for IGBT Module in HEV/EV Application by XU Ninghua, WU Yibo, LIU Guoyou, DOU Zechun

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Packaging Consideration and Development for Fully Sintered SiC Power Module by DAI Xiaoping, WU Yibo, ZHAO Yimin, WANG Yangang

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The Mechanism, Calculation and Simulation of Power Loss for IGBT Modules by WANG Yangang, DAI Xiaoping, WU Yibo, JONES Steve, LIU Guoyou

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Research and Application of IGBT in Electric Vehicle by GUO Shuying, WANG Zhengyu, LUO Haihui, ZHANG Xuhui, WU Yibo, QIN Rongzhen

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Measurement and Analysis of Transmission Error of the Robot RV Reducer by Wang Haixia, Wu Qingfeng, Wu Yibo, Wang Qingzhong, Zheng Boheng, Hu Weijian

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Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle by WANG Yangang, LIU Xuyu, DAI Xiaoping, WU Yibo, PENG Yongdian, LIU Guoyou

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Development and reliability and validity testing of a medication literacy scale for medical college students by Zeng Leixiao, Sun Xiaonan, Pan Lutong, Gu Wenjing, Xiao Chang, Tang Jingqi, Dai Wenting, Kang Xiuqin, Wu Yibo

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Development of a Comprehensive Fall Risk Assessment Tool for Older People in Elderly Care Institutions and Its Test by LUO Yuan, ZHANG Hua, WANG Sanxiang, ZHANG Mengxi, DENG Yuqian, RAN Haiye, LIU Jiaxin, ZHANG Yi, CHEN Xi, WU Yibo, ZHAO Liping

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