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    Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation

    Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation by Ting-Yu Lee, Yu-Li Chen, Sheng-Jye Hwang, Chun-Yu Ko, Wei-Lun Cheng

    Published 2025-06-01
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