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  1. 1
    Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

    Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip by S. A. France, B. C. Heap

    Published 1977-01-01
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  2. 2
    New AIM/CIPS global observations of gravity waves near 50–55 km

    New AIM/CIPS global observations of gravity waves near 50–55 km by C. E. Randall, J. Carstens, J. A. France, V. L. Harvey, L. Hoffmann, S. M. Bailey, M. J. Alexander, J. D. Lumpe, J. Yue, B. Thurairajah, D. E. Siskind, Y. Zhao, M. J. Taylor, J. M. Russell III

    Published 2017-07-01
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