Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu by Yun-Fong Lee, Chih-Wen Chiu, Chin-Yen Chiu, Yu-Chen Huang, Mei-Hsin Lo, Liu-Hsin-Chen Yang, Ting-Yi Cheng, Zhong-Yen Yu, Chih-En Hsu, Kai-Chi Lin, Po-Yu Chen, Wei-Cheih Huang, Jui-Sheng Chang, Shao-An Pan, Yi-Cheng Su, Chin-Li Lin, Hang-Chen Hsieh, Chia-Hua Lin, Cheng-Yi Liu

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