Evaluation of Copper Diffusion Bonding Parameters Applied to the Manufacture of Flat Heat Pipes by Larissa Perego Mendes, Maria Cristina Amaral, Lucas de Andrade Caldas, Bianca Müller Martins, Kelvin Guessi Domiciano, Larissa Krambeck, Fabio Antonio Xavier, Marcia Barbosa Henriques Mantelli

Get full text