Development of hypoeutectic SnBi alloy solder reinforced with WO3 nanoparticles for connecting Cu substrates via thermal bonding
Abstract WO3 nanoparticles with different loading amounts (0.25 to 1.00 wt%) were mechanically mixed with Sn–Bi alloys (10 and 20 wt% Bi) for 45 min. The Sn–Bi nanocomposite powders were mixed with a flux mixture to form solder pastes. Solder pastes with different WO3 nanoparticles were deposited on...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-02-01
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| Series: | Scientific Reports |
| Subjects: | |
| Online Access: | https://doi.org/10.1038/s41598-025-89729-z |
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