TOPCon Solar Cells With Al-Free Ag and Cu Metallization

TOPCon Solar Cells With Al-Free Ag and Cu Metallization

This work presents an approach to lower the silver consumption of screen printed TOPCon (Tunnel Oxide Passivated Contact) solar cells by reducing and partially replacing the silver by low cost copper metallization paste. On the solar cells front side an adapted process sequence enables the use of a...

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Bibliographic Details
Main Authors: Jan Lossen, Pirmin Preis, Mertcan Comak, Joris Libal, Dominik Rudolph, Jan Hoß, Lejo Joseph Koduvelikulathu
Format: Article
Language:English
Published: TIB Open Publishing 2024-12-01
Series:SiliconPV Conference Proceedings
Subjects:
Ag-Reduction
Cu-Paste
Sustainability
TOPCon
Metallization
Online Access:https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1316
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