TOPCon Solar Cells With Al-Free Ag and Cu Metallization
This work presents an approach to lower the silver consumption of screen printed TOPCon (Tunnel Oxide Passivated Contact) solar cells by reducing and partially replacing the silver by low cost copper metallization paste. On the solar cells front side an adapted process sequence enables the use of a...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
TIB Open Publishing
2024-12-01
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| Series: | SiliconPV Conference Proceedings |
| Subjects: | |
| Online Access: | https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1316 |
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